wire bonder造句
例句與造句
- Set up an ultrasonic wire bonding laboratory
成立超聲波電子焊接實(shí)驗(yàn)室 - Wire bond parameter optimization in semiconductor assembly
半導(dǎo)體封裝超聲波壓焊的工藝參數(shù)優(yōu)化 - Application of statistical process control in wire bonding
現(xiàn)場(chǎng)總線技術(shù)在燒堿蒸發(fā)工藝中的應(yīng)用 - Automatic encapsulating auto - wire bonding machine
自動(dòng)分光機(jī) - Standard practice for nondestructive pull testing of wire bonds
金屬絲連接的非破壞性抗拉試驗(yàn)的標(biāo)準(zhǔn)實(shí)施規(guī)范 - It's difficult to find wire bonder in a sentence. 用wire bonder造句挺難的
- Ultrasonic wire bonding
超聲波線焊 - Standard test methods for measuring pull strength of microelectronic wire bonds
微電子器件金屬絲連接抗拉強(qiáng)度測(cè)量的標(biāo)準(zhǔn)試驗(yàn)方法 - Test method for adhesion strength of bondable films to substrates in ribbon - wire bonds
綁線連接時(shí)可粘性膜同襯底的粘結(jié)強(qiáng)度的試驗(yàn)方法 - Wire bonded chip
線焊芯片 - With the development of mems industry , a higher request for automation wire bonding is put forward
隨著mems技術(shù)逐漸進(jìn)入產(chǎn)業(yè)化發(fā)展階段,對(duì)引線鍵合的自動(dòng)化和批量化提出了更高的要求。 - Plasma systems 400 and 660 are low - pressure microwave plasma systems for cleaning advanced chip packages prior to die attach , wire bond and encapsulation
等離子體400和660系列是低壓微波等離子體應(yīng)用于提高模具粘合，引線的焊接，特別是清洗高級(jí)的芯片封裝。 - In addition to improvements in wire bonder hardware , it is necessary to develop a steady wire bonding process which satisfies the requirements for ultra - fine - pitch wire bonding
目前除了需要不斷提高鍵合機(jī)硬件性能外，開發(fā)滿足超細(xì)間距引線鍵合要求且性能穩(wěn)定的鍵合工藝十分必要。 - Ultrasonic wire bonding was applied to connect the contacts and sub - miniature - a ( sma ) connectors . also a suitable shield box has been designed for the test of hts filters
對(duì)于超導(dǎo)濾波器的焊接，采用超聲點(diǎn)焊焊接sma的接頭和高溫超導(dǎo)濾波器的接觸電極，實(shí)現(xiàn)了較小的接觸電阻和較好的機(jī)械強(qiáng)度。 - Wire bonding is the most classical and most mature technique for ic interconnection , which takes most of the market share , there are also a lot of research on ultra - fine - pitch wire interconnection must to do
摘要引線鍵合是應(yīng)用時(shí)間最長、技術(shù)最為成熟且目前市場(chǎng)?有率最高的芯片連接技術(shù)，但應(yīng)用于超細(xì)間距引線互連還有許多技術(shù)有待研究。 - Wire bonding is the most extensively used packing technology for mems manufacturing . while the existing mems packing processes are usually operated by manual labor under microscopes , and the consistency and the finished product rate are highly influenced by operators ’ experience and mental state
引線鍵合是mems器件加工中應(yīng)用最為廣泛的一種封裝工藝,現(xiàn)有的mems引線鍵合絕大多數(shù)是由操作者在顯微鏡下手工操作完成,操作者的經(jīng)驗(yàn)和精神狀態(tài)直接影響引線工藝的一致性和成品率。